Thermal resistance

Ming, Tingzhen, Cunjin Cai, Wei Yang, Wenqing Shen, Wei Feng, and Nan Zhou. "Optimization of Dimples in Microchannel Heat Sink with Impinging Jets—Part B: the Influences of Dimple Height and Arrangement." Journal of Thermal Science 27.4 (2018) 321–330.

Google Scholar | DOI | BibTeX | Endnote tagged

Prasher, Ravi S. "Rheology based modeling and design of particle laden polymeric thermal interface materials." IEEE Trans. Compon. Packag. Technol. 28 (2005) 230–237.

Google Scholar | DOI | BibTeX | Endnote tagged

Prasher, Ravi S, John Dirner, Je-Young Chang, Alan M Myers, David Chau, Dongming He, and Suzana Prstic. "Thermal Resistance and Pressure Drop of Silicon Based Micro Pin Fin Heat Exchanger Under Cross Flow." ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference. American Society of Mechanical Engineers, 2005. 717–725.

Chang, Je-Young, Ravi S Prasher, Suzana Prstic, P Cheng, and H B Ma. "Evaporative Thermal Performance of Vapor Chambers Under Nonuniform Heating Conditions." J. Heat Transfer 130 (2008) 121501.

Google Scholar | DOI | BibTeX | Endnote tagged

Prasher, Ravi S, Tao Tong, and Arun Majumdar. "Thermal Resistance of Nano Constrictions." ASME 2006 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 2006. 535–540.

Torresola, Javier, Chia-Pin Chiu, Gregory M Chrysler, Dean Grannes, Ravi Mahajan, Ravi S Prasher, and Abhay A Watwe. "Density factor approach to representing impact of die power maps on thermal management." IEEE Trans. Adv. Packag. 28.4 (2005) 659–664.

Google Scholar | DOI | BibTeX | Endnote tagged

Prasher, Ravi S, and J C Matayabas. "Thermal contact resistance of cured gel polymeric thermal interface material." IEEE Trans. Compon. Packag. Technol. 27 (2004) 702–709.

Google Scholar | DOI | BibTeX | Endnote tagged

Patterson, M K, Xiaojin Wei, Y Joshi, and Ravi S Prasher. "Numerical study of conjugate heat transfer in stacked microchannels." The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543). Vol. 1. 2004. 372–380 Vol.1.

Devpura, Amit, Patrick E Phelan, and Ravi S Prasher. "Percolation theory applied to the analysis of thermal interface materials in flip-chip technology." ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069). Vol. 1. 2000. 21–28.

Prasher, Ravi S, and Chia-Pin Chiu. Thermal Interface Materials. Ed. Daniel Lu and C.P Wong. Second. Cham, Switzerland: Springer International Publishing, 2017.