@article{31122,
  keywords = {Cooling, Energy management, Temperature, Microelectronics, Thermal management, Power distribution, Thermal resistance, Heat sinks, Hotspots, Thermal factors, Thermal management (packaging), Packaging, Density factor approach, Die power map impact, Impedance, Micromechanical devices, Nonuniform heating, Package thermal resistances},
  author = {Javier Torresola and Chia-Pin Chiu and Gregory M Chrysler and Dean Grannes and Ravi Mahajan and Ravi S Prasher and Abhay A Watwe},
  title = {Density factor approach to representing impact of die power maps on thermal management},
  abstract = {<p><span>In the microelectronics industry, power has traditionally been the key driver for thermal management. Cooling solutions are typically rated in terms of their power dissipation capacity and efficiency. However, overall power is not the only parameter that affects thermal management. For instance, it is well-known that power density is also important (i.e., it is easier to cool 50 W uniformly distributed on a 20/spl times/20 mm die than the same power on a 10/spl times/10 mm die). Furthermore, even if the die size remains unchanged, nonuniform power distribution at the die level can create localized regions of high power density that require thermal management. This paper proposes a simple metric, density factor (DF/sub jx/), to be used in conjunction with power for quantifying the impact of power density on a given thermal solution. The advantages, limitations, and applicability of this metric are discussed.</span></p>},
  year = {2005},
  journal = {IEEE Trans. Adv. Packag.},
  volume = {28},
  pages = {659–664},
  month = {11/2005},
  issn = {1557-9980},
  doi = {10.1109/TADVP.2005.858439},
  language = {eng},
}