%0 Journal Article
%K Cooling
%K Energy management
%K Temperature
%K Microelectronics
%K Thermal management
%K Power distribution
%K Thermal resistance
%K Heat sinks
%K Hotspots
%K Thermal factors
%K Thermal management (packaging)
%K Packaging
%K Density factor approach
%K Die power map impact
%K Impedance
%K Micromechanical devices
%K Nonuniform heating
%K Package thermal resistances
%A Javier Torresola
%A Chia-Pin Chiu
%A Gregory M Chrysler
%A Dean Grannes
%A Ravi Mahajan
%A Ravi S Prasher
%A Abhay A Watwe
%B IEEE Trans. Adv. Packag.
%D 2005
%G eng
%N 4
%P 659–664
%R 10.1109/TADVP.2005.858439
%T Density factor approach to representing impact of die power maps on thermal management
%V 28
%8 11/2005