%0 Journal Article
%K Rheology
%K Thermal cycling
%K Thermal resistance
%K Thermal interface materials (TIMs)
%K Contact resistance
%K Flip-chip devices
%K Curable polymer gel
%K Cured gel polymer
%K Electrical resistance measurement
%K Flip-chip packages
%K Gel type behavior
%K Grease type behavior
%K Heat spreaders
%K Loss measurement
%K Loss shear modulus
%K Mechanical factors
%K Packaging
%K Performance loss
%K Polymer gels
%K Polymer rheology
%K Post reliability stress
%K Predictive models
%K Semianalytical model
%K Storage shear modulus
%K Thermal contact resistance
%K Thermal interface material
%K Thermal stresses
%A Ravi S Prasher
%A J C Matayabas
%B IEEE Trans. Compon. Packag. Technol.
%D 2004
%G eng
%P 702–709
%R 10.1109/TCAPT.2004.838883
%T Thermal contact resistance of cured gel polymeric thermal interface material
%V 27
%X <p>This paper reports the experimental results on the contact resistance of curable polymer gel thermal interface materials (TIMs) that have different mechanical properties due to difference in the rheology of the polymers. A semi-analytical model for the prediction of the thermal contact resistance of cured gel TIMs is also introduced in this paper. A novel method of finding the transition from grease type behavior to gel type behavior, which is very important for post reliability stress performance, based on G' (storage shear modulus) and G'' (loss shear modulus) measurements is reported. Further, post thermal cycling thermal resistance degradation rate of gel TIMs are related to the ratio of G and G''. Finally, design guidelines for gel TIMs for use in flip-chip packages comprising heat spreaders are proposed.</p>