%0 Journal Article
%K Rheology
%K Thermal cycling
%K Thermal resistance
%K Thermal interface materials (TIMs)
%K Contact resistance
%K Flip-chip devices
%K Curable polymer gel
%K Cured gel polymer
%K Electrical resistance measurement
%K Flip-chip packages
%K Gel type behavior
%K Grease type behavior
%K Heat spreaders
%K Loss measurement
%K Loss shear modulus
%K Mechanical factors
%K Packaging
%K Performance loss
%K Polymer gels
%K Polymer rheology
%K Post reliability stress
%K Predictive models
%K Semianalytical model
%K Storage shear modulus
%K Thermal contact resistance
%K Thermal interface material
%K Thermal stresses
%A Ravi S Prasher
%A J C Matayabas
%B IEEE Trans. Compon. Packag. Technol.
%D 2004
%G eng
%P 702–709
%R 10.1109/TCAPT.2004.838883
%T Thermal contact resistance of cured gel polymeric thermal interface material
%V 27