%0 Journal Article
%K Cooling
%K Thermal conductivity
%K Polymers
%K Rheology
%K Thermal resistance
%K Conducting materials
%K Contact resistance
%K Surface resistance
%K Thermal interface materials (TIMs)
%K Thermal stresses
%K Bond line thickness (BLT)
%K Bonding
%K Die size
%K Finite size scaling
%K Immune system
%K Integrated circuit design
%K Integrated circuit modeling
%K Particle diameter
%K Particle laden polymeric (PLP)
%K Particle laden polymeric (PLP)
%K Particle volume faction
%K Thermal conductivity model
%K Thermal design reduction
%K Thermal interface materials (TIMs)
%K Yield stress
%A Ravi S Prasher
%B IEEE Trans. Compon. Packag. Technol.
%D 2005
%G eng
%P 230–237
%R 10.1109/TCAPT.2005.848492
%T Rheology based modeling and design of particle laden polymeric thermal interface materials
%V 28
%8 06/2005