%0 Journal Article
%K Cooling
%K Thermal conductivity
%K Polymers
%K Rheology
%K Thermal resistance
%K Conducting materials
%K Contact resistance
%K Surface resistance
%K Thermal interface materials (TIMs)
%K Thermal stresses
%K Bond line thickness (BLT)
%K Bonding
%K Die size
%K Finite size scaling
%K Immune system
%K Integrated circuit design
%K Integrated circuit modeling
%K Particle diameter
%K Particle laden polymeric (PLP)
%K Particle laden polymeric (PLP)
%K Particle volume faction
%K Thermal conductivity model
%K Thermal design reduction
%K Thermal interface materials (TIMs)
%K Yield stress
%A Ravi S Prasher
%B IEEE Trans. Compon. Packag. Technol.
%D 2005
%G eng
%P 230–237
%R 10.1109/TCAPT.2005.848492
%T Rheology based modeling and design of particle laden polymeric thermal interface materials
%V 28
%8 06/2005
%X <p>Most of the research on particle laden polymeric (PLP) thermal interface materials (TIM) have been primarily focused ob understanding the thermal conductivity of these types of TIMs. For thermal design reduction of the thermal resistance is the end goal. Thermal resistance is not only dependent on the thermal conductivity, but also on the bond line thickness (BLT) of these TIMs. This paper introduces a rheology based model for the prediction of the BLT of these TIMs from very low to very high pressures. BLT depends on the yield stress of the particle laden polymer and the applied pressure. The model is based on the concept of finite size scaling of physical properties of particle laden systems at very thin length scale due to percolation phenomenon in these materials. This paper shows that the yield stress of the PLP increases with decreasing thickness of the TIM and therefore it is size dependent. The BLT model combined with the thermal conductivity model can be used for modeling the thermal resistance of these TIMs for factors such as particle volume faction, substrate/die size, pressure and particle diameter.</p>