Je-Young Chang
Publications
Viewing 21 of 21 publications
2007
High-Speed Visualization of Phase-Change Processes in Silicon Microchannels With Water and HFE-7100 as Working Fluids." ASME 2007 International Mechanical Engineering Congress and ExpositionVolume 5: Electronics and Photonics. Seattle, Washington, USA: ASME, 2007.
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Performances of Silicon Micro-Flow-Passage Cold Plates From Single-Phase to Two-Phase With Water and HFE-7100 as Working Fluids." ASME 2007 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 2007. 95–110.
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Cooling of Electronic Chips Using Microchannel and Micro-Pin Fin Heat Exchangers." ASME 2008 6th International Conference on Nanochannels, Microchannels, and Minichannels. American Society of Mechanical Engineers, 2008. 1881–1887.
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2006
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New Electrochemical Cell Designs and Test Methods for Corrosion Testing of the Components in Integrated Circuit Liquid Cooling Systems." ASME 2006 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 2006. 257–265.
, , , , , and . "Performance of Two-Phase Microchannels at Sub-Atmospheric Pressure." ASME 2006 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 2006. 183–192.
, , , , , and . "Nusselt Number and Friction Factor of Staggered Arrays of Low Aspect Ratio Micro-Pin-Fins Under Cross Flow for Water as Fluid." ASME 2006 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 2006. 9–20.
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Thermal Resistance and Pressure Drop of Silicon Based Micro Pin Fin Heat Exchanger Under Cross Flow." ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference. American Society of Mechanical Engineers, 2005. 717–725.
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, , , , and . Thermal Performance and Key Challenges for Future CPU Cooling Technologies." ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference. American Society of Mechanical Engineers, 2005. 353–364.
, , , , , , and . "Convective Performance of Package Based Single Phase Microchannel Heat Exchanger." ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference. American Society of Mechanical Engineers, 2005. 183–188.
, , , , , , and . "Effect of Localized Hotspot on the Thermal Performance of Two-Phase Microchannel Heat Exchanger." ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference. American Society of Mechanical Engineers, 2005. 99–103.
, , , , , , and . "Thermal Performance of Vapor Chambers Under Hot Spot Heating Conditions." ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference. American Society of Mechanical Engineers, 2005. 197–203.
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Analysis and active control of pressure-drop flow instabilities in boiling microchannel systems." International Journal of Heat and Mass Transfer 53 (2010) 2347–2360.
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Ledinegg instability in microchannels." Int. J. Heat Mass Transf. 52 (2009) 5661–5674.
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