Je-Young Chang
Publications
Viewing 21 of 21 publications
2010
, , , , , , and . "Analysis and active control of pressure-drop flow instabilities in boiling microchannel systems." International Journal of Heat and Mass Transfer 53 (2010) 2347–2360.
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2009
, , , , , , , and . "Ledinegg instability in microchannels." Int. J. Heat Mass Transf. 52 (2009) 5661–5674.
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2008
, , , , and . "Evaporative Thermal Performance of Vapor Chambers Under Nonuniform Heating Conditions." J. Heat Transfer 130 (2008) 121501.
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, and . "Cooling of Electronic Chips Using Microchannel and Micro-Pin Fin Heat Exchangers." ASME 2008 6th International Conference on Nanochannels, Microchannels, and Minichannels. American Society of Mechanical Engineers, 2008. 1881–1887.
, , , and . "Preventing burst-related hazards in microelectronic cooling systems." 2008.
2007
, , , , , and . "High-Speed Visualization of Phase-Change Processes in Silicon Microchannels With Water and HFE-7100 as Working Fluids." ASME 2007 International Mechanical Engineering Congress and ExpositionVolume 5: Electronics and Photonics. Seattle, Washington, USA: ASME, 2007.
, , , , , and . "Performances of Silicon Micro-Flow-Passage Cold Plates From Single-Phase to Two-Phase With Water and HFE-7100 as Working Fluids." ASME 2007 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 2007. 95–110.
, , , , , , and . "Integrated circuit coolant microchannel with compliant cover." 2007.
, , , , , , , , and . "Integrated circuit coolant microchannel assembly with targeted channel configuration." 2007.
2006
, , , , , and . "New Electrochemical Cell Designs and Test Methods for Corrosion Testing of the Components in Integrated Circuit Liquid Cooling Systems." ASME 2006 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 2006. 257–265.
, , , , , and . "Performance of Two-Phase Microchannels at Sub-Atmospheric Pressure." ASME 2006 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 2006. 183–192.
, , , , , , and . "Nusselt Number and Friction Factor of Staggered Arrays of Low Aspect Ratio Micro-Pin-Fins Under Cross Flow for Water as Fluid." ASME 2006 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 2006. 9–20.
, , , , , and . "Apparatus for using fluid laden with nanoparticles for application in electronic cooling." 2006.
, , , and . "Apparatus and associated method for microelectronic cooling." 2006.
2005
, , , , , , and . "Thermal Resistance and Pressure Drop of Silicon Based Micro Pin Fin Heat Exchanger Under Cross Flow." ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference. American Society of Mechanical Engineers, 2005. 717–725.
, , , , and . Bearing life: A future package cooling challenge. Vol. 14. 2005.
, , , , , , and . "Thermal Performance and Key Challenges for Future CPU Cooling Technologies." ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference. American Society of Mechanical Engineers, 2005. 353–364.
, , , , , , and . "Convective Performance of Package Based Single Phase Microchannel Heat Exchanger." ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference. American Society of Mechanical Engineers, 2005. 183–188.
, , , , , , and . "Effect of Localized Hotspot on the Thermal Performance of Two-Phase Microchannel Heat Exchanger." ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference. American Society of Mechanical Engineers, 2005. 99–103.
, , , and . "Thermal Performance of Vapor Chambers Under Hot Spot Heating Conditions." ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference. American Society of Mechanical Engineers, 2005. 197–203.