Integrated circuit coolant microchannel assembly with targeted channel configuration

Date Published
08/2007
Publication Type
Patent
Authors
Abstract

A microchannel structure has microchannels formed therein. The microchannels are to transport a coolant and to be proximate to an integrated circuit to transfer heat from the integrated circuit to the coolant. At least one of the microchannels has a length extent and has a first section at a first location along the length extent and a second section at a second location along the length extent. The first section of the microchannel has a first aspect ratio and the second section is divided into at least two sub-channels. Each sub-channel has a respective second aspect ratio that is greater than the first aspect ratio.

Year of Publication
2007
Application Number
7259965
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