Chia-Pin Chiu
Publications
Viewing 8 of 8 publications
2004
Thermal interface materials: a brief review of design characteristics and materials." Electronics Cooling (2004).
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2007
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2005
Density factor approach to representing impact of die power maps on thermal management." IEEE Trans. Adv. Packag. 28.4 (2005) 659–664.
, , , , , , and . "Thermal Performance and Key Challenges for Future CPU Cooling Technologies." ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference. American Society of Mechanical Engineers, 2005. 353–364.
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Thermal Interface Materials. Ed. and . Second. Cham, Switzerland: Springer International Publishing, 2017.
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