TY - JOUR KW - Cooling KW - Energy management KW - Temperature KW - Microelectronics KW - Thermal management KW - Power distribution KW - Thermal resistance KW - Heat sinks KW - Hotspots KW - Thermal factors KW - Thermal management (packaging) KW - Packaging KW - Density factor approach KW - Die power map impact KW - Impedance KW - Micromechanical devices KW - Nonuniform heating KW - Package thermal resistances AU - Javier Torresola AU - Chia-Pin Chiu AU - Gregory M Chrysler AU - Dean Grannes AU - Ravi Mahajan AU - Ravi S Prasher AU - Abhay A Watwe AB -

In the microelectronics industry, power has traditionally been the key driver for thermal management. Cooling solutions are typically rated in terms of their power dissipation capacity and efficiency. However, overall power is not the only parameter that affects thermal management. For instance, it is well-known that power density is also important (i.e., it is easier to cool 50 W uniformly distributed on a 20/spl times/20 mm die than the same power on a 10/spl times/10 mm die). Furthermore, even if the die size remains unchanged, nonuniform power distribution at the die level can create localized regions of high power density that require thermal management. This paper proposes a simple metric, density factor (DF/sub jx/), to be used in conjunction with power for quantifying the impact of power density on a given thermal solution. The advantages, limitations, and applicability of this metric are discussed.

BT - IEEE Trans. Adv. Packag. DA - 11/2005 DO - 10.1109/TADVP.2005.858439 IS - 4 LA - eng N2 -

In the microelectronics industry, power has traditionally been the key driver for thermal management. Cooling solutions are typically rated in terms of their power dissipation capacity and efficiency. However, overall power is not the only parameter that affects thermal management. For instance, it is well-known that power density is also important (i.e., it is easier to cool 50 W uniformly distributed on a 20/spl times/20 mm die than the same power on a 10/spl times/10 mm die). Furthermore, even if the die size remains unchanged, nonuniform power distribution at the die level can create localized regions of high power density that require thermal management. This paper proposes a simple metric, density factor (DF/sub jx/), to be used in conjunction with power for quantifying the impact of power density on a given thermal solution. The advantages, limitations, and applicability of this metric are discussed.

PY - 2005 EP - 659–664 T2 - IEEE Trans. Adv. Packag. TI - Density factor approach to representing impact of die power maps on thermal management VL - 28 SN - 1557-9980 ER -