Integrated circuit coolant microchannel with compliant cover
Date Published |
08/2007
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Publication Type | Patent
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Abstract |
An apparatus includes a microchannel structure having microchannels formed therein. The microchannels are to transport a coolant and to be proximate to an integrated circuit to transfer heat from the integrated circuit to the coolant. The apparatus also includes a cover positioned on the microchannel structure to define a respective upper wall of each of the microchannels. The cover presents a compliant surface to the microchannels. |
Year of Publication |
2007
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Application Number |
7243705
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