Integrated circuit coolant microchannel with compliant cover

Date Published
08/2007
Publication Type
Patent
Authors
Abstract

An apparatus includes a microchannel structure having microchannels formed therein. The microchannels are to transport a coolant and to be proximate to an integrated circuit to transfer heat from the integrated circuit to the coolant. The apparatus also includes a cover positioned on the microchannel structure to define a respective upper wall of each of the microchannels. The cover presents a compliant surface to the microchannels.

Year of Publication
2007
Application Number
7243705
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Organizations
Research Areas
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