TY - PAT AU - Alan M Myers AU - Je-Young Chang AU - Ravi S Prasher AU - Ioan Sauciuc AU - Gregory M Chrysler AU - Patrick D Boyd AU - Chia-Pin Chiu AB -
An apparatus includes a microchannel structure having microchannels formed therein. The microchannels are to transport a coolant and to be proximate to an integrated circuit to transfer heat from the integrated circuit to the coolant. The apparatus also includes a cover positioned on the microchannel structure to define a respective upper wall of each of the microchannels. The cover presents a compliant surface to the microchannels.
DA - 08/2007 LA - eng M1 - 7243705 N2 -An apparatus includes a microchannel structure having microchannels formed therein. The microchannels are to transport a coolant and to be proximate to an integrated circuit to transfer heat from the integrated circuit to the coolant. The apparatus also includes a cover positioned on the microchannel structure to define a respective upper wall of each of the microchannels. The cover presents a compliant surface to the microchannels.
PY - 2007 TI - Integrated circuit coolant microchannel with compliant cover UR - https://patents.google.com/patent/US7259965B2/en ER -