TY - JOUR KW - Rheology KW - Thermal cycling KW - Thermal resistance KW - Thermal interface materials (TIMs) KW - Contact resistance KW - Flip-chip devices KW - Curable polymer gel KW - Cured gel polymer KW - Electrical resistance measurement KW - Flip-chip packages KW - Gel type behavior KW - Grease type behavior KW - Heat spreaders KW - Loss measurement KW - Loss shear modulus KW - Mechanical factors KW - Packaging KW - Performance loss KW - Polymer gels KW - Polymer rheology KW - Post reliability stress KW - Predictive models KW - Semianalytical model KW - Storage shear modulus KW - Thermal contact resistance KW - Thermal interface material KW - Thermal stresses AU - Ravi S Prasher AU - J C Matayabas AB -

This paper reports the experimental results on the contact resistance of curable polymer gel thermal interface materials (TIMs) that have different mechanical properties due to difference in the rheology of the polymers. A semi-analytical model for the prediction of the thermal contact resistance of cured gel TIMs is also introduced in this paper. A novel method of finding the transition from grease type behavior to gel type behavior, which is very important for post reliability stress performance, based on G' (storage shear modulus) and G'' (loss shear modulus) measurements is reported. Further, post thermal cycling thermal resistance degradation rate of gel TIMs are related to the ratio of G and G''. Finally, design guidelines for gel TIMs for use in flip-chip packages comprising heat spreaders are proposed.

BT - IEEE Trans. Compon. Packag. Technol. DO - 10.1109/TCAPT.2004.838883 LA - eng M1 - 4 N2 -

This paper reports the experimental results on the contact resistance of curable polymer gel thermal interface materials (TIMs) that have different mechanical properties due to difference in the rheology of the polymers. A semi-analytical model for the prediction of the thermal contact resistance of cured gel TIMs is also introduced in this paper. A novel method of finding the transition from grease type behavior to gel type behavior, which is very important for post reliability stress performance, based on G' (storage shear modulus) and G'' (loss shear modulus) measurements is reported. Further, post thermal cycling thermal resistance degradation rate of gel TIMs are related to the ratio of G and G''. Finally, design guidelines for gel TIMs for use in flip-chip packages comprising heat spreaders are proposed.

PY - 2004 EP - 702–709 T2 - IEEE Trans. Compon. Packag. Technol. TI - Thermal contact resistance of cured gel polymeric thermal interface material VL - 27 ER -