Contact resistance
Rheology based modeling and design of particle laden polymeric thermal interface materials." IEEE Trans. Compon. Packag. Technol. 28 (2005) 230–237.
. "A Unified Microscopic and Macroscopic Thermal Contact Resistance Model." ASME 2006 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 2006. 525–533.
, and . "Thermal contact resistance of cured gel polymeric thermal interface material." IEEE Trans. Compon. Packag. Technol. 27 (2004) 702–709.
, and . "Percolation theory applied to the analysis of thermal interface materials in flip-chip technology." ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069). Vol. 1. 2000. 21–28.
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