%0 Journal Article
%K modeling
%K Thermal conductivity
%K pressure
%K surface roughness
%K contact resistance
%K Errors
%K Surface energy
%K Surface science
%A Ravi S Prasher
%B J. Heat Transfer
%D 2001
%G eng
%I … .asmedigitalcollection.asme.org
%R 10.1115/1.1388301
%T Surface chemistry and characteristics based model for the thermal contact resistance of fluidic interstitial thermal interface materials
%8 02/2001
%X <p>Microprocessor powers are increasing at a phenomenal rate, which requires very small thermal resistance between the die (chip) and the ambient, if the current economical methods of conduction and convection cooling are to be utilized. A typical thermal solution in …</p>