TY - JOUR
KW - Modeling
KW - Thermal conductivity
KW - Pressure
KW - Surface roughness
KW - Contact resistance
KW - Errors
KW - Surface energy
KW - Surface science
AU - Ravi S Prasher
AB - <p>Microprocessor powers are increasing at a phenomenal rate, which requires very small thermal resistance between the die (chip) and the ambient, if the current economical methods of conduction and convection cooling are to be utilized. A typical thermal solution in …</p>
BT - J. Heat Transfer
DA - 02/2001
DO - 10.1115/1.1388301
LA - eng
N2 - <p>Microprocessor powers are increasing at a phenomenal rate, which requires very small thermal resistance between the die (chip) and the ambient, if the current economical methods of conduction and convection cooling are to be utilized. A typical thermal solution in …</p>
PB - … .asmedigitalcollection.asme.org
PY - 2001
T2 - J. Heat Transfer
TI - Surface chemistry and characteristics based model for the thermal contact resistance of fluidic interstitial thermal interface materials
ER -