@article{Prasher2001-ch,
  keywords = {Modeling, Thermal conductivity, Pressure, Surface roughness, Contact resistance, Errors, Surface energy, Surface science},
  author = {Ravi S Prasher},
  title = {Surface chemistry and characteristics based model for the thermal contact resistance of fluidic interstitial thermal interface materials},
  abstract = {<p>Microprocessor powers are increasing at a phenomenal rate, which requires very small thermal resistance between the die (chip) and the ambient, if the current economical methods of conduction and convection cooling are to be utilized. A typical thermal solution in {\textellipsis}</p>},
  year = {2001},
  booktitle = {J. Heat Transfer},
  journal = {J. Heat Transfer},
  series = {J. Heat Transfer},
  month = {02/2001},
  institution = {{\textellipsis} .asmedigitalcollection.asme.org},
  publisher = {{\textellipsis} .asmedigitalcollection.asme.org},
  doi = {10.1115/1.1388301},
  language = {eng},
}