Surface chemistry and characteristics based model for the thermal contact resistance of fluidic interstitial thermal interface materials
| Date Published |
02/2001
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| Publication Type | Journal Article
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| DOI |
10.1115/1.1388301
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| Abstract |
Microprocessor powers are increasing at a phenomenal rate, which requires very small thermal resistance between the die (chip) and the ambient, if the current economical methods of conduction and convection cooling are to be utilized. A typical thermal solution in … |
| Journal |
J. Heat Transfer
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| Year of Publication |
2001
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| Publisher |
… .asmedigitalcollection.asme.org
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