Prasher Lab
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Convective Performance of Package Based Single Phase Microchannel Heat Exchanger." ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference. American Society of Mechanical Engineers, 2005. 183–188.
, , , , , , and . "Numerical Modeling of Boiling Heat Transfer in Microchannels." ASME 2005 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 2005. 739–748.
, , , and . "Effect of Localized Hotspot on the Thermal Performance of Two-Phase Microchannel Heat Exchanger." ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference. American Society of Mechanical Engineers, 2005. 99–103.
, , , , , , and . "Thermal Performance of Vapor Chambers Under Hot Spot Heating Conditions." ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference. American Society of Mechanical Engineers, 2005. 197–203.
, , , and . "Thermal Conduction Phenomena in Advanced Interface Materials for Electronics Cooling." ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems. American Society of Mechanical Engineers, 2005. 963–966.
, , and . "Microscopic Effective Medium Model for Thermal Conductivity of Two Dimensional Nano-Porous and Micro-Porous Media." ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems. American Society of Mechanical Engineers, 2005. 355–358.
, and . "Thermal contact resistance of cured gel polymeric thermal interface material." IEEE Trans. Compon. Packag. Technol. 27 (2004) 702–709.
, and . "Thermal Performance and Key Challenges for Future CPU Cooling Technologies." ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference. American Society of Mechanical Engineers, 2005. 353–364.
, , , , , , and . "Modeling of Radiative and Optical Behavior of Nanofluids Based on Multiple and Dependent Scattering Theories." ASME 2005 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 2005. 739–743.
, and . "Thermal transport cross section and phase function of longitudinal phonons for scattering by nanoparticles and microparticles." J. Appl. Phys. 96 (2004) 5202–5211.
. "Non-dimensional size effects on the thermodynamic properties of solids." Int. J. Heat Mass Transf. 42 (1999) 1991–2001.
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Microchannel Experimental Structure for Measuring Temperature Fields During Convective Boiling." ASME 2004 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 2004. 699–705.
, , , , , , , , and . "Scattering of Phonons by Nano and Micro Particles." ASME 2004 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 2004. 3–14.
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Numerical study of conjugate heat transfer in stacked microchannels." The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543). Vol. 1. 2004. 372–380 Vol.1.
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