Thermal Conduction Phenomena in Advanced Interface Materials for Electronics Cooling
Date Published |
01/2005
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Publication Type | Conference Paper
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Authors | |
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DOI |
10.1115/HT2005-72729
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Abstract |
Thermal resistances at packaging interfaces are occupying a larger portion of the overall thermal resistance from a semiconductor die to ambient. Substantial improvement of the performance of thermal interface materials (TIMs) is required to achieve effective electronic cooling. This report is a brief review of the current status of TIM research. Particular focus is given to the fundamental understanding of heat conduction phenomena in polymer-based TIM composites at packaging interfaces in thin-film form. Promising nanostructured TIMs for future applications are also discussed. |
Conference Name |
ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems
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Year of Publication |
2005
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Pagination |
963–966
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Publisher |
American Society of Mechanical Engineers
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