%0 Conference Paper
%K Computer cooling
%K Heat conduction
%A Xuejiao Hu
%A Ravi S Prasher
%A Kenneth E Goodson
%B ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems
%D 2005
%G eng
%I American Society of Mechanical Engineers
%P 963–966
%R 10.1115/HT2005-72729
%T Thermal Conduction Phenomena in Advanced Interface Materials for Electronics Cooling
%8 01/2005
%X <p><span>Thermal resistances at packaging interfaces are occupying a larger portion of the overall thermal resistance from a semiconductor die to ambient. Substantial improvement of the performance of thermal interface materials (TIMs) is required to achieve effective electronic cooling. This report is a brief review of the current status of TIM research. Particular focus is given to the fundamental understanding of heat conduction phenomena in polymer-based TIM composites at packaging interfaces in thin-film form. Promising nanostructured TIMs for future applications are also discussed.</span></p>