@inproceedings{31107,
  keywords = {Computer cooling, Heat conduction},
  author = {Xuejiao Hu and Ravi S Prasher and Kenneth E Goodson},
  title = {Thermal Conduction Phenomena in Advanced Interface Materials for Electronics Cooling},
  abstract = {<p><span>Thermal resistances at packaging interfaces are occupying a larger portion of the overall thermal resistance from a semiconductor die to ambient. Substantial improvement of the performance of thermal interface materials (TIMs) is required to achieve effective electronic cooling. This report is a brief review of the current status of TIM research. Particular focus is given to the fundamental understanding of heat conduction phenomena in polymer-based TIM composites at packaging interfaces in thin-film form. Promising nanostructured TIMs for future applications are also discussed.</span></p>},
  year = {2005},
  journal = {ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems},
  pages = {963–966},
  month = {01/2005},
  publisher = {American Society of Mechanical Engineers},
  doi = {10.1115/HT2005-72729},
  language = {eng},
}