Computer cooling
Thermal Performance and Key Challenges for Future CPU Cooling Technologies." ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference. American Society of Mechanical Engineers, 2005. 353–364.
, , , , , , and . "Thermal Conduction Phenomena in Advanced Interface Materials for Electronics Cooling." ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems. American Society of Mechanical Engineers, 2005. 963–966.
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