Packaging

Torresola, Javier, Chia-Pin Chiu, Gregory M Chrysler, Dean Grannes, Ravi Mahajan, Ravi S Prasher, and Abhay A Watwe. "Density factor approach to representing impact of die power maps on thermal management." IEEE Trans. Adv. Packag. 28.4 (2005) 659–664.

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Prasher, Ravi S, and J C Matayabas. "Thermal contact resistance of cured gel polymeric thermal interface material." IEEE Trans. Compon. Packag. Technol. 27 (2004) 702–709.

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