Energy Technologies Area
Modification of Planck Blackbody Emissive Power and Intensity in Particulate Media Due to Multiple and Dependent Scattering." J. Heat Transfer 127 (2005) 903–910.
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Numerical modelling of boiling heat transfer in microchannels." Appl. Therm. Eng. 29 (2009) 300–309.
, , and . "Modeling of Phonon Thermal Conductivity of Two Dimensional Nano and Micro Composites in the Longitudinal Direction." ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems. American Society of Mechanical Engineers, 2005. 359–363.
. "Bearing life: A future package cooling challenge. Vol. 14. 2005.
, , , , and . Planck blackbody emissive power in particulate media." Appl. Phys. Lett. 86 (2005) 071914.
. "An Effective Unit Cell Approach to Compute the Thermal Conductivity of Composites With Cylindrical Particles." J. Heat Transfer 127 (2005) 553–559.
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Convective Performance of Package Based Single Phase Microchannel Heat Exchanger." ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference. American Society of Mechanical Engineers, 2005. 183–188.
, , , , , , and . "Numerical Modeling of Boiling Heat Transfer in Microchannels." ASME 2005 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 2005. 739–748.
, , , and . "Effect of Localized Hotspot on the Thermal Performance of Two-Phase Microchannel Heat Exchanger." ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference. American Society of Mechanical Engineers, 2005. 99–103.
, , , , , , and . "Thermal Performance of Vapor Chambers Under Hot Spot Heating Conditions." ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference. American Society of Mechanical Engineers, 2005. 197–203.
, , , and . "Thermal Conduction Phenomena in Advanced Interface Materials for Electronics Cooling." ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems. American Society of Mechanical Engineers, 2005. 963–966.
, , and . "Microscopic Effective Medium Model for Thermal Conductivity of Two Dimensional Nano-Porous and Micro-Porous Media." ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems. American Society of Mechanical Engineers, 2005. 355–358.
, and . "Thermal contact resistance of cured gel polymeric thermal interface material." IEEE Trans. Compon. Packag. Technol. 27 (2004) 702–709.
, and . "Thermal Performance and Key Challenges for Future CPU Cooling Technologies." ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference. American Society of Mechanical Engineers, 2005. 353–364.
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