Energy Technologies Area
, and . "Microscopic Effective Medium Model for Thermal Conductivity of Two Dimensional Nano-Porous and Micro-Porous Media." ASME 2005 Summer Heat Transfer Conference collocated with the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems. American Society of Mechanical Engineers, 2005. 355–358.
. "Thermal transport cross section and phase function of longitudinal phonons for scattering by nanoparticles and microparticles." J. Appl. Phys. 96 (2004) 5202–5211.
. "Scattering of Phonons by Nano and Micro Particles." ASME 2004 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 2004. 3–14.
, , , and . "Numerical study of conjugate heat transfer in stacked microchannels." The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543). Vol. 1. 2004. 372–380 Vol.1.
, and . "Non-dimensional size effects on the thermodynamic properties of solids." Int. J. Heat Mass Transf. 42 (1999) 1991–2001.
, , , , , and . "Integrated vapor chamber heat sink and spreader and an embedded direct heat pipe attachment." 2003.
, , , , , , , , , , , , and . "VLSI Hotspot Cooling Using Two-Phase Microchannel Convection." ASME 2002 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 2002. 13–19.
, and . "Thermal cooling apparatus." 2003.
, , , , , , , and . "Experimental study on two-phase heat transfer in microchannel heat sinks with hotspots." Ninteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium, 2003. 2003. 242–246.
, , , and . "Electronic assembly having a heat pipe that conducts heat from a semiconductor die." 2003.
. "Generalized equation of phonon radiative transport." Appl. Phys. Lett. 83 (2003) 48–50.
, , , and . "Direct heatpipe attachment to die using center point loading." 2003.
, and . "Size Effects on the Thermodynamic Properties of Thin Solid Films." J. Heat Transfer 120 (1998) 1078–1081.
, , and . "Thermal Boundary Resistance at a Plane Boundary Using the SMAMM and Various Scattering Mechanisms." Thermal Science and Engineering 7 (1999) 53–60.
, , and . "Percolation theory applied to the analysis of thermal interface materials in flip-chip technology." ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069). Vol. 1. 2000. 21–28.