Thermal management (packaging)

Zhang, T, J T Wen, Y Peles, T Tong, J Chang, Ravi S Prasher, and Michael K Jensen. "Micro-thermal-fluid transient analysis and active control for two-phase microelectronics cooling." 2010 IEEE International Conference on Automation Science and Engineering. 2010.

Torresola, Javier, Chia-Pin Chiu, Gregory M Chrysler, Dean Grannes, Ravi Mahajan, Ravi S Prasher, and Abhay A Watwe. "Density factor approach to representing impact of die power maps on thermal management." IEEE Trans. Adv. Packag. 28.4 (2005) 659–664.

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Patterson, M K, Xiaojin Wei, Y Joshi, and Ravi S Prasher. "Numerical study of conjugate heat transfer in stacked microchannels." The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543). Vol. 1. 2004. 372–380 Vol.1.