Micro-thermal-fluid transient analysis and active control for two-phase microelectronics cooling
Date Published |
08/2010
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Publication Type | Conference Paper
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DOI |
10.1109/COASE.2010.5584171
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Abstract |
Because of increasing power densities, microchannel systems are being explored for two-phase cooling of ultra high power electronic devices. Flow instability is a potential problem in any two-phase microchannel cooling system especially for transient applications. With various two-phase flow stabilities possible in a microscale boiling system, the overall cooling performance deteriorates significantly. For better dynamic thermal management of microelectronic systems, a family of oscillatory flow boiling heat transfer correlations and active stabilizing flow control methods have been developed. |
Conference Name |
2010 IEEE International Conference on Automation Science and Engineering
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Year of Publication |
2010
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