Micro-thermal-fluid transient analysis and active control for two-phase microelectronics cooling

Date Published
08/2010
Publication Type
Conference Paper
Authors
DOI
10.1109/COASE.2010.5584171
Abstract

Because of increasing power densities, microchannel systems are being explored for two-phase cooling of ultra high power electronic devices. Flow instability is a potential problem in any two-phase microchannel cooling system especially for transient applications. With various two-phase flow stabilities possible in a microscale boiling system, the overall cooling performance deteriorates significantly. For better dynamic thermal management of microelectronic systems, a family of oscillatory flow boiling heat transfer correlations and active stabilizing flow control methods have been developed.

Conference Name
2010 IEEE International Conference on Automation Science and Engineering
Year of Publication
2010
Keywords
Organizations
Research Areas
Download citation