TY - CPAPER
KW - Cooling
KW - Heat transfer
KW - Heating
KW - Temperature measurement
KW - Microchannel
KW - Two-phase flow
KW - Integrated circuit packaging
KW - Thermal management (packaging)
KW - Active control
KW - 0 inlet
KW - A microchannel crossectional area
KW - Bo boiling number (equation)
KW - C boiling channels
KW - Cpwsilicon heat capacity
KW - Dhmicrochannel hydraulic diameter ($\approx$100µm)
KW - Dynamic thermal management
KW - F fluid (water)
KW - Flow control methods
KW - FM flow meter
KW - G mass flux
KW - Hfgfluid latent heat
KW - I inertia
KW - L/Lwmicrochannel length (=15mm)
KW - ṁ mass flowrate
KW - MC microchannel
KW - Microelectronic systems
KW - Microthermal-fluid transient analysis
KW - Oscillators
KW - Oscillatory flow boiling heat transfer correlations
KW - P pressure
KW - Pwmicrochannel perimeter (=605µm)
KW - Q/q″ heat load / heat flux (q″ = q/Sw)
KW - R restrictor
KW - Re Reynolds number (equation)
KW - S surge tank
KW - Swmicrochannel surface area (= pwLw)
KW - T temperature
KW - Transient analysis
KW - Two-phase microelectronics cooling
KW - Tzwlocal wall temperature at location z
KW - W silicon wall
KW - We Weber number (equation)
KW - αw heat transfer coefficient
KW - µ viscosity
KW - ρ density
KW - σ surface tension
AU - T Zhang
AU - J T Wen
AU - Y Peles
AU - T Tong
AU - J Chang
AU - Ravi S Prasher
AU - Michael K Jensen
AB - <p><span>Because of increasing power densities, microchannel systems are being explored for two-phase cooling of ultra high power electronic devices. Flow instability is a potential problem in any two-phase microchannel cooling system especially for transient applications. With various two-phase flow stabilities possible in a microscale boiling system, the overall cooling performance deteriorates significantly. For better dynamic thermal management of microelectronic systems, a family of oscillatory flow boiling heat transfer correlations and active stabilizing flow control methods have been developed.</span></p>
BT - 2010 IEEE International Conference on Automation Science and Engineering
DA - 08/2010
DO - 10.1109/COASE.2010.5584171
LA - eng
N2 - <p><span>Because of increasing power densities, microchannel systems are being explored for two-phase cooling of ultra high power electronic devices. Flow instability is a potential problem in any two-phase microchannel cooling system especially for transient applications. With various two-phase flow stabilities possible in a microscale boiling system, the overall cooling performance deteriorates significantly. For better dynamic thermal management of microelectronic systems, a family of oscillatory flow boiling heat transfer correlations and active stabilizing flow control methods have been developed.</span></p>
PY - 2010
T2 - 2010 IEEE International Conference on Automation Science and Engineering
T3 - 2010 IEEE International Conference on Automation Science and Engineering
TI - Micro-thermal-fluid transient analysis and active control for two-phase microelectronics cooling
ER -