@inproceedings{31595,
  keywords = {Cooling, Heat transfer, Heating, Temperature measurement, Microchannel, Two-phase flow, Integrated circuit packaging, Thermal management (packaging), Active control, 0 inlet, A microchannel crossectional area, Bo boiling number (equation), C boiling channels, Cpwsilicon heat capacity, Dhmicrochannel hydraulic diameter ($\approx$100{\textmu}m), Dynamic thermal management, F fluid (water), Flow control methods, FM flow meter, G mass flux, Hfgfluid latent heat, I inertia, L/Lwmicrochannel length (=15mm), m mass flowrate, MC microchannel, Microelectronic systems, Microthermal-fluid transient analysis, Oscillators, Oscillatory flow boiling heat transfer correlations, P pressure, Pwmicrochannel perimeter (=605{\textmu}m), Q/q" heat load / heat flux (q" = q/Sw), R restrictor, Re Reynolds number (equation), S surge tank, Swmicrochannel surface area (= pwLw), T temperature, Transient analysis, Two-phase microelectronics cooling, Tzwlocal wall temperature at location z, W silicon wall, We Weber number (equation), αw heat transfer coefficient, {\textmu} viscosity, ρ density, σ surface tension},
  author = {T Zhang and J T Wen and Y Peles and T Tong and J Chang and Ravi S Prasher and Michael K Jensen},
  title = {Micro-thermal-fluid transient analysis and active control for two-phase microelectronics cooling},
  abstract = {<p><span>Because of increasing power densities, microchannel systems are being explored for two-phase cooling of ultra high power electronic devices. Flow instability is a potential problem in any two-phase microchannel cooling system especially for transient applications. With various two-phase flow stabilities possible in a microscale boiling system, the overall cooling performance deteriorates significantly. For better dynamic thermal management of microelectronic systems, a family of oscillatory flow boiling heat transfer correlations and active stabilizing flow control methods have been developed.</span></p>},
  year = {2010},
  booktitle = {2010 IEEE International Conference on Automation Science and Engineering},
  journal = {2010 IEEE International Conference on Automation Science and Engineering},
  series = {2010 IEEE International Conference on Automation Science and Engineering},
  month = {08/2010},
  doi = {10.1109/COASE.2010.5584171},
  language = {eng},
}