@inproceedings{31167,
  keywords = {cooling, Heat Transfer, heating, temperature measurement, Microchannel, Two-phase flow, integrated circuit packaging, thermal management (packaging), Active control, 0 inlet, A microchannel crossectional area, Bo boiling number (equation), c boiling channels, Cpwsilicon heat capacity, Dhmicrochannel hydraulic diameter ($\approx$100µm), dynamic thermal management, f fluid (water), flow control methods, FM flow meter, G mass flux, hfgfluid latent heat, I inertia, L/Lwmicrochannel length (=15mm), ṁ mass flowrate, MC microchannel, microelectronic systems, microthermal-fluid transient analysis, Oscillators, oscillatory flow boiling heat transfer correlations, P pressure, pwmicrochannel perimeter (=605µm), q/q″ heat load / heat flux (q″ = q/Sw), r restrictor, Re Reynolds number (equation), s surge tank, Swmicrochannel surface area (= pwLw), T temperature, Transient analysis, two-phase microelectronics cooling, Tzwlocal wall temperature at location z, w silicon wall, We Weber number (equation), αw heat transfer coefficient, µ viscosity, ρ density, σ surface tension},
  author = {T Zhang and J T Wen and Y Peles and T Tong and J Chang and Ravi S Prasher and Michael K Jensen},
  title = {Micro-thermal-fluid transient analysis and active control for two-phase microelectronics cooling},
  abstract = {<p><span>Because of increasing power densities, microchannel systems are being explored for two-phase cooling of ultra high power electronic devices. Flow instability is a potential problem in any two-phase microchannel cooling system especially for transient applications. With various two-phase flow stabilities possible in a microscale boiling system, the overall cooling performance deteriorates significantly. For better dynamic thermal management of microelectronic systems, a family of oscillatory flow boiling heat transfer correlations and active stabilizing flow control methods have been developed.</span></p>},
  year = {2010},
  journal = {2010 IEEE International Conference on Automation Science and Engineering},
  month = {08/2010},
  doi = {10.1109/COASE.2010.5584171},
  language = {eng},
}