Heat sinks
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, , , , , , and . "Numerical study of conjugate heat transfer in stacked microchannels." The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543). Vol. 1. 2004. 372–380 Vol.1.
, , , and . "Experimental study on two-phase heat transfer in microchannel heat sinks with hotspots." Ninteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium, 2003. 2003. 242–246.
, , , , , , , and . "Percolation theory applied to the analysis of thermal interface materials in flip-chip technology." ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069). Vol. 1. 2000. 21–28.
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