Reworkable thermal interface material
Date Published |
08/2007
|
---|---|
Publication Type | Patent
|
Authors | |
---|---|
Abstract |
A process of making a reworkable thermal interface material is described. The reworkable thermal interface material is bonded to a die and a heat sink. The reworkable thermal interface material includes a phase-change polymer matrix material. Other materials in the reworkable thermal interface material can include heat transfer particles and low melting-point metal particles. The phase-change polymer matrix material includes a melting temperature below a selected temperature and the heat transfer particles have a melting temperature substantially above the selected temperature. The heat transfer particles act as a spacer limit, which holds the thermal interface material to a given bond-line thickness during use. |
Year of Publication |
2007
|
Application Number |
7253523
|
URL | |
Organizations | |
Research Areas | |
Download citation |