%0 Patent
%A Ashay A Dani
%A Scott Gilbert
%A Ajit Sathe V
%A Ravi S Prasher
%D 2007
%G eng
%T Reworkable thermal interface material
%U https://patents.google.com/patent/US7253523B2/en
%8 08/2007
%X <p>A process of making a reworkable thermal interface material is described. The reworkable thermal interface material is bonded to a die and a heat sink. The reworkable thermal interface material includes a phase-change polymer matrix material. Other materials in the reworkable thermal interface material can include heat transfer particles and low melting-point metal particles. The phase-change polymer matrix material includes a melting temperature below a selected temperature and the heat transfer particles have a melting temperature substantially above the selected temperature. The heat transfer particles act as a spacer limit, which holds the thermal interface material to a given bond-line thickness during use.</p>