Structured illumination with thermal imaging (SI-TI): A dynamically reconfigurable metrology for parallelized thermal transport characterization
Date Published |
05/2022
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Publication Type | Journal Article
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Authors | |
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DOI |
10.1063/5.0079842
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Abstract |
The recent push for the “materials by design” paradigm requires synergistic integration of scalable computation, synthesis, and characterization. Among these, techniques for efficient measurement of thermal transport can be a bottleneck limiting the experimental database size, especially for diverse materials with a range of roughness, porosity, and anisotropy. Traditional contact thermal measurements have challenges with throughput and the lack of spatially resolvable property mapping, while non-contact pump-probe laser methods generally need mirror smooth sample surfaces and also require serial raster scanning to achieve property mapping. Here, we present structured illumination with thermal imaging (SI-TI), a new thermal characterization tool based on parallelized all-optical heating and thermometry. Experiments on representative dense and porous bulk materials as well as a 3D printed thermoelectric thick film (∼50 μm) demonstrate that SI-TI (1) enables paralleled measurement of multiple regions and samples without raster scanning; (2) can dynamically adjust the heating pattern purely in software, to optimize the measurement sensitivity in different directions for anisotropic materials; and (3) can tolerate rough (∼3 μm) and scratched sample surfaces. This work highlights a new avenue in adaptivity and throughput for thermal characterization of diverse materials.
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Journal |
Applied Physics Reviews
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Volume |
9
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Year of Publication |
2022
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Issue |
2
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Pagination |
021411
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URL | |
Short Title |
Applied Physics Reviews
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Refereed Designation |
Refereed
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Organizations | |
Research Areas | |
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