%0 Journal Article
%A Qiye Zheng
%A Divya Chalise
%A Mingxin Jia
%A Yuqiang Zeng
%A Minxiang Zeng
%A Mortaza Saeidi-Javash
%A Ali N.M Tanvir
%A Gottlieb Uahengo
%A Sumanjeet Kaur
%A Javier E Garay
%A Tengfei Luo
%A Yanliang Zhang
%A Ravi S Prasher
%A Chris Dames
%B Applied Physics Reviews
%D 2022
%G eng
%N 2
%P 021411
%R 10.1063/5.0079842
%T Structured illumination with thermal imaging (SI-TI): A dynamically reconfigurable metrology for parallelized thermal transport characterization
%U https://aip.scitation.org/doi/10.1063/5.0079842
%V 9
%8 05/2022
%! Applied Physics Reviews
%X
The recent push for the “materials by design” paradigm requires synergistic integration of scalable computation, synthesis, and characterization. Among these, techniques for efficient measurement of thermal transport can be a bottleneck limiting the experimental database size, especially for diverse materials with a range of roughness, porosity, and anisotropy. Traditional contact thermal measurements have challenges with throughput and the lack of spatially resolvable property mapping, while non-contact pump-probe laser methods generally need mirror smooth sample surfaces and also require serial raster scanning to achieve property mapping. Here, we present structured illumination with thermal imaging (SI-TI), a new thermal characterization tool based on parallelized all-optical heating and thermometry. Experiments on representative dense and porous bulk materials as well as a 3D printed thermoelectric thick film (∼50 μm) demonstrate that SI-TI (1) enables paralleled measurement of multiple regions and samples without raster scanning; (2) can dynamically adjust the heating pattern purely in software, to optimize the measurement sensitivity in different directions for anisotropic materials; and (3) can tolerate rough (∼3 μm) and scratched sample surfaces. This work highlights a new avenue in adaptivity and throughput for thermal characterization of diverse materials.