Method for cooling an integrated circuit die with coolant flow in a microchannel and a thin film thermoelectric cooling device in the microchannel
Date Published |
06/2011
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Publication Type | Patent
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Abstract |
A method includes an integrated circuit (IC) die that has a front surface on which an integrated circuit is formed. The IC die also has a rear surface that is opposite to the front surface. The method also includes a microchannel member to define at least one microchannel at the rear surface of the IC die. The microchannel is to allow a coolant to flow through the microchannel. The method further includes at least one thin film thermoelectric cooling (TFTEC) device in the at least one microchannel. |
Year of Publication |
2011
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Application Number |
7957137
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