@misc{31199,
  author = {Ravi S Prasher},
  title = {Method for cooling an integrated circuit die with coolant flow in a microchannel and a thin film thermoelectric cooling device in the microchannel},
  abstract = {<p>A method includes an integrated circuit (IC) die that has a front surface on which an integrated circuit is formed. The IC die also has a rear surface that is opposite to the front surface. The method also includes a microchannel member to define at least one microchannel at the rear surface of the IC die. The microchannel is to allow a coolant to flow through the microchannel. The method further includes at least one thin film thermoelectric cooling (TFTEC) device in the at least one microchannel.</p>},
  year = {2011},
  number = {7957137},
  month = {06/2011},
  url = {https://patents.google.com/patent/US7957137B2/en},
  language = {eng},
}