Thermal interface materials (TIMs)
. "Rheology based modeling and design of particle laden polymeric thermal interface materials." IEEE Trans. Compon. Packag. Technol. 28 (2005) 230–237.
Google Scholar | DOI | BibTeX | Endnote tagged | RIS
, , and . "Percolation theory applied to the analysis of thermal interface materials in flip-chip technology." ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069). Vol. 1. 2000. 21–28.