Flip-chip devices

Prasher, Ravi S, and J C Matayabas. "Thermal contact resistance of cured gel polymeric thermal interface material." IEEE Trans. Compon. Packag. Technol. 27 (2004) 702–709.

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Devpura, Amit, Patrick E Phelan, and Ravi S Prasher. "Percolation theory applied to the analysis of thermal interface materials in flip-chip technology." ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069). Vol. 1. 2000. 21–28.