An acoustic and dimensional mismatch model for thermal boundary conductance between a vertical mesoscopic nanowire/nanotube and a bulk substrate

Date Published
11/2007
Publication Type
Journal Article
Authors
DOI
10.1063/1.2816260
Abstract

A theoretical model to calculate the thermal boundary conductance (Kapitza conductance) or, alternatively, thermal boundary resistance (Kapitza resistance) between a vertically grown mesoscopic nanowire/nanotube and a bulk substrate is presented. The thermal boundary resistance at the interface between the mesoscopic geometry and a three-dimensional substrate is primarily due to two reasons: (1) dimensional mismatch in the phonon density of states and (2) mismatch in the acoustic properties. Our model based on the solution of the elastic wave equation in the substrate and the mesoscopic geometry incorporates both these effects.

Journal
J. Appl. Phys.
Volume
102
Year of Publication
2007
Number
10
Pagination
104312
Publisher
American Institute of Physics
Organizations
Research Areas
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