Electronic assembly having a heat pipe that conducts heat from a semiconductor die

Date Published
03/2003
Publication Type
Patent
Authors
Abstract

An electronic assembly is described including a motherboard, a semiconductor die mounted to the motherboard, and a heat pipe having an evaporator portion adjacent the die, and a condenser portion distant from the die. The heat pipe is connected to a ground plane of the motherboard at various locations. Structural integrity of the heat pipe is provided by an insert in an evaporator portion of the heat pipe and because of opposing recessed seat portions that contact one another. Another feature of the electronic assembly is that it has a sheet of material forming a plurality of fins that are welded to a condenser portion of the heat pipe.

Year of Publication
2003
Application Number
6535386
URL
Organizations
Research Areas
Download citation