%0 Journal Article %A Qiye Zheng %A Divya Chalise %A Mingxin Jia %A Yuqiang Zeng %A Minxiang Zeng %A Mortaza Saeidi-Javash %A Ali N.M Tanvir %A Gottlieb Uahengo %A Sumanjeet Kaur %A Javier E Garay %A Tengfei Luo %A Yanliang Zhang %A Ravi S Prasher %A Chris Dames %B Applied Physics Reviews %D 2022 %G eng %N 2 %P 021411 %R 10.1063/5.0079842 %T Structured illumination with thermal imaging (SI-TI): A dynamically reconfigurable metrology for parallelized thermal transport characterization %U https://aip.scitation.org/doi/10.1063/5.0079842 %V 9 %8 06/2022 %! Applied Physics Reviews %X
The recent push for the “materials by design” paradigm requires synergistic integration of scalable computation, synthesis, and characterization. Among these, techniques for efficient measurement of thermal transport can be a bottleneck limiting the experimental database size, especially for diverse materials with a range of roughness, porosity, and anisotropy. Traditional contact thermal measurements have challenges with throughput and the lack of spatially resolvable property mapping, while non-contact pump-probe laser methods generally need mirror smooth sample surfaces and also require serial raster scanning to achieve property mapping. Here, we present structured illumination with thermal imaging (SI-TI), a new thermal characterization tool based on parallelized all-optical heating and thermometry. Experiments on representative dense and porous bulk materials as well as a 3D printed thermoelectric thick film (∼50 μm) demonstrate that SI-TI (1) enables paralleled measurement of multiple regions and samples without raster scanning; (2) can dynamically adjust the heating pattern purely in software, to optimize the measurement sensitivity in different directions for anisotropic materials; and (3) can tolerate rough (∼3 μm) and scratched sample surfaces. This work highlights a new avenue in adaptivity and throughput for thermal characterization of diverse materials.