%0 Patent
%A Kramadhati Ravi V
%A Ravi S Prasher
%A Gregory M Chrysler
%D 2006
%G eng
%T IC die with directly bonded liquid cooling device
%U https://patents.google.com/patent/US7071552B2/en
%8 07/2006
%X <p>An apparatus includes an integrated circuit (IC) die having a substrate formed of a first semiconductor material and a cooling device form of a second semiconductor material. The cooling device is directly mounted to the substrate of the IC die.</p>