%0 Patent
%A Ravi S Prasher
%D 2009
%G eng
%T Cooling an integrated circuit die with coolant flow in a microchannel and a thin film thermoelectric cooling device in the microchannel
%U https://patents.google.com/patent/US7633752B2/en
%8 12/2009
%X <p>An apparatus includes an integrated circuit (IC) die that has a front surface on which an integrated circuit is formed. The IC die also has a rear surface that is opposite to the front surface. The apparatus also includes a microchannel member to define at least one microchannel at the rear surface of the IC die. The microchannel is to allow a coolant to flow through the microchannel. The apparatus further includes at least one thin film thermoelectric cooling (TFTEC) device in the at least one microchannel.</p>