%0 Patent
%A Ashish Gupta
%A Leonel R Arana
%A David W Song
%A Chia-Pin Chiu
%A Ravi S Prasher
%A Chris Matayabas
%A Nirupama Chakrapani
%D 2008
%G eng
%T Microelectronic package including thermally conductive sealant between heat spreader and substrate
%U https://patents.google.com/patent/US20080237843A1/en
%8 10/2008
%X <p>A microelectronic package. The package includes a substrate; a die mounted onto the substrate; an integrated heat spreader mounted onto the substrate, and thermally coupled to a backside of the die; and a sealant material bonding the integrated heat spreader to the substrate, the sealant material having a bulk thermal conductivity above about 1 W/m/° C. and a modulus of elasticity lower than a modulus of elasticity of solder.</p>