%0 Patent
%A Ravi S Prasher
%A Chia-Pin Chiu
%A Himanshu Pokharna
%D 2005
%G eng
%T Thermal management arrangement with channels structurally adapted for varying heat flux areas
%U https://patents.google.com/patent/US20050285261A1/en
%X <p>An apparatus, method, and system for a thermal management arrangement for cooling semiconductor packages with channels structurally adapted for varying heat flux areas.</p>