%0 Conference Paper
%K Cooling
%K Design
%K Heat transfer
%K Density
%K Microelectronic devices
%K Refrigeration
%K Microchannels
%K Blocks (Building materials)
%K Boundary-value problems
%K Computer cooling
%K Heat pipes
%K Industrial research
%K Vapors
%A Ioan Sauciuc
%A Ravi S Prasher
%A Je-Young Chang
%A Hakan Erturk
%A Gregory M Chrysler
%A Chia-Pin Chiu
%A Ravi Mahajan
%B ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference
%D 2005
%G eng
%I American Society of Mechanical Engineers
%P 353–364
%R 10.1115/IPACK2005-73242
%S ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference
%T Thermal Performance and Key Challenges for Future CPU Cooling Technologies