%0 Conference Paper
%K Cooling
%K Computational fluid dynamics
%K Temperature
%K Heat transfer
%K Thermal conductivity
%K Silicon
%K Elemental semiconductors
%K Si
%K Thermal management
%K Convection
%K Thermal resistance
%K Microchannel
%K Heat sinks
%K Channel flow
%K Convective heat transfer coefficient
%K Electronics packaging
%K Flexible control
%K Flow passage direction
%K Flow simulation
%K Heat load
%K High end electronics cooling
%K Logic
%K Silicon temperature
%K Stacked microchannel heat sink
%K Temperature nonuniformity
%K Thermal factors
%K Thermal management (packaging)
%A M K Patterson
%A Xiaojin Wei
%A Y Joshi
%A Ravi S Prasher
%B The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543)
%D 2004
%G eng
%P 372–380 Vol.1
%R 10.1109/ITHERM.2004.1319199
%S The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543)
%T Numerical study of conjugate heat transfer in stacked microchannels
%V 1
%8 06/2004