%0 Conference Paper
%K Cooling
%K Heat transfer
%K Plasma temperature
%K Temperature distribution
%K Convection
%K Microchannel
%K Heat sinks
%K Chip maximum junction temperature
%K Circuits
%K Cross-linked microchannel heat sink
%K Electronic equipment
%K Electronics cooling
%K Fluid mixing
%K Heat flux
%K Hotspots
%K Integrated circuit reliability
%K Lateral fluid transport
%K Mass flow distribution
%K Materials testing
%K Microchannel heat sinks
%K Performance degradation
%K Reliability degradation
%K Spatially nonuniform heat flux
%K Temperature uniformity
%K Transducers
%K Two-phase convective heat transfer
%A Eun Seok Cho
%A Jae-Mo Koo
%A Linan Jiang
%A Ravi S Prasher
%A Min Soo Kim
%A J G Santiago
%A T W Kenny
%A Kenneth E Goodson
%B Ninteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium, 2003.
%D 2003
%G eng
%P 242–246
%R 10.1109/STHERM.2003.1194369
%S Ninteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium, 2003.
%T Experimental study on two-phase heat transfer in microchannel heat sinks with hotspots
%8 11/2003