%0 Patent
%A Abhay A Watwe
%A Ravi S Prasher
%D 2003
%G eng
%T Thermal cooling apparatus
%U https://patents.google.com/patent/US6504721B1/en
%8 01/2003
%X <p>A method and apparatus for cooling a heat source in an electronic device is provided. The apparatus includes a vapor chamber with a heat source at a first end. A heat sink can be provided at a second end of the vapor chamber. The vapor chamber absorbs the heat generated by the heat source. The heat is then transferred via the vapor chamber to a plurality of fins attached to the vapor chamber. If a heat sink is provided, the heat is also transferred via the vapor chamber to the heat sink. The heat sink can also include a plurality of fins. The fins and the heat sink then convectively dissipate the heat to the atmosphere.</p>