%0 Conference Paper
%K Thermal conductivity
%K Polymers
%K Conducting polymers
%K Thermal resistance
%K Chip scale packaging
%K Conducting materials
%K Contact resistance
%K Filler concentration
%K Flip chip
%K Flip-chip devices
%K Flip-chip technology
%K Heat dissipation
%K Heat sink
%K Heat sinks
%K Heat spreader
%K Highly conducting particles
%K Imperfect contacts
%K Integrated circuit packaging
%K Matrix thickness
%K Percolation
%K Percolation theory
%K Resistance heating
%K Surface resistance
%K Thermal interface materials (TIMs)
%A Amit Devpura
%A Patrick E Phelan
%A Ravi S Prasher
%B ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069)
%D 2000
%G eng
%P 21–28
%R 10.1109/ITHERM.2000.866803
%S ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069)
%T Percolation theory applied to the analysis of thermal interface materials in flip-chip technology
%V 1
%8 05/2000